Low-temperature agglomeration of argentiferous paste at connection silicon with molybdenum
Lukin V.I., Rylnikov V.S., Loshinin U.V., Nischev K.N. Low-temperature agglomeration of argentiferous paste at connection silicon with molybdenum // Proceedings of VIAM. 2015. No. 7. DOI: 10.18577/2307-6046-2015-0-7-4-4. URL: https://test.viam.ru/en/journal/2015/7/4
Abstract
The article is about investigating of heat effects taking place while drying and sintering of silver containing paste, used to get low temperature joints in system of «Si on Mo» for semiconductor elements. It was investigated the modifications in form and size of silver particles taking place during drying at different temperatures. The relationship between micro hardness of sintered layers and temperature was investigated.
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