Influence of the composition and conditions of heat treatment of the conductive properties of silver-containing electrically conductive adhesive compositions (review)

Part 2
Besednov K.L., Petrova A.P., Lukina N.F., Isaev A.Yu.
UDC
665.939.5
DOI
10.18577/2307-6046-2021-0-11-44-54
Article PDF (Russian) (845.62 KB)
How to cite
Besednov K.L., Petrova A.P., Lukina N.F., Isaev A.Yu. Influence of the composition and conditions of heat treatment of the conductive properties of silver-containing electrically conductive adhesive compositions (review). Part 2 // Proceedings of VIAM. 2021. No. 11. DOI: 10.18577/2307-6046-2021-0-11-44-54. URL: https://test.viam.ru/en/journal/2021/11/5
Keywords
conductive adhesive, silver filler, electrical conductivity, volume resistivity, polymer resin part, cure shrinkage.
Abstract

The influence of the chemical nature and component composition of the polymer base and the curing conditions of conductive adhesive compositions on their conductive properties is shown. The values of the volumetric shrinkage during the curing of the adhesive are compared with the realized level of conductive properties. The influence of the temperature level during curing on the electrical conductivity of the cured glue is shown. Shrinkage phenomena, viscosity, temperature range of the curing reaction were investigated as factors determining the appearance and formation of the conductive properties of conductive compositions during curing.

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