Influence of the composition and conditions of heat treatment of the conductive properties of silver-containing electrically conductive adhesive compositions (review)

Part 1
Besednov K.L., Petrova A.P., Lukina N.F., Isaev A.Yu.
UDC
667.621.262.2
DOI
10.18577/2307-6046-2021-0-5-64-77
Article PDF (Russian) (1.3 MB)
How to cite
Besednov K.L., Petrova A.P., Lukina N.F., Isaev A.Yu. Influence of the composition and conditions of heat treatment of the conductive properties of silver-containing electrically conductive adhesive compositions (review). Part 1 // Proceedings of VIAM. 2021. No. 5. DOI: 10.18577/2307-6046-2021-0-5-64-77. URL: https://test.viam.ru/en/journal/2021/5/7
Keywords
conductive adhesive, silver filler, electrical conductivity, thermal conductivity, microstructure, electrically volume resistivity, polymer base, nanoscale particles.
Abstract

Data on the use of various types of silver filler in electrically conductive adhesive compositions are presented. The influence of form and size particles of silver filler on the conductive properties of adhesive bondline.

The effect of surface treatment of conductive particles with surfactants, the component composition of the resin part and the curing conditions of conductive adhesive compositions on their microstructure and conductive properties is shown.An overview of the results of studies of the microstructure of conductive silver-containing adhesive compositions is given.

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