Determination of boron in solders based on nickel VPr24 and VPr27

Titov V.I.
UDC
621.791.37.042.2-034.24
DOI
10.18577/2307-6046-2017-0-9-12-12
Article PDF (Russian) (459.27 KB)
How to cite
Titov V.I. Determination of boron in solders based on nickel VPr24 and VPr27 // Proceedings of VIAM. 2017. No. 9. DOI: 10.18577/2307-6046-2017-0-9-12-12. URL: https://test.viam.ru/en/journal/2017/9/12
Keywords
photometry, H-resorcinol, complexon III, boron, nickel solders.
Abstract

As a result of the research and experimental work on the possible determination of boron content in solders based on nickel VPr24 and VPr27, a photometric analysis method was used. The main reagent was chosen H-resorcinol. Using this reagent, the reaction proceeds in a weakly acidic medium, there is no need to extract the complex formed with organic solvents. During the experiment, it was found that one of the components of the solder – niobium – interacts with the reagent H-resorcinol, thereby negatively affecting the possibility of correct determination of boron content. Masking reagent, allowing to obtain correct results of the analysis, was selected complexon III. To prevent loss of boron during the sample preparation, phosphoric acid must be added. As a result of the conducted studies, a technique for determining the boron content in the concentration range 0,1–3,0% by weight was developed in solders based on nickel VPr24 and VPr27.

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