About possible destruction causes of vacuum melted PZlM-type solders

Galkin V.I., Golovkin P.A., Dvoretskov R.M., Galkin E.V.
UDC
621.791.3
DOI
10.18577/2307-6046-2026-0-4-146-157
Article PDF (Russian) (1.23 MB)
How to cite
Galkin V.I., Golovkin P.A., Dvoretskov R.M., Galkin E.V. About possible destruction causes of vacuum melted PZlM-type solders // Proceedings of VIAM. 2026. No. 4. DOI: 10.18577/2307-6046-2026-0-4-146-157. URL: https://test.viam.ru/en/journal/2026/4/12
Keywords
electrovacuum devices, solder wire, technical specifications, chemical composition, gold, copper, impurities, state diagrams, solubility, alloy structure ordering, degradation
Abstract

The study considers possible destruction causes of the PZlM-type solder wire made of gold-copper alloys used for soldering and assembling of components in electrovacuum devices. The possible causes of wire defects are impurities of rhodium and ruthenium, entering into the solder wire due to improper control of the chemical composition of the source materials, caused by the imperfection of the current regulatory documentation for solders and their components. It is proposed to carry out the output control of manufactured PZlM-type solders after at least 10 days, required for recrystallization and alignement of the material after preliminary annealing.

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